Increase your company’s visibility — share knowledge at ASMC
SAN JOSE, Calif. — September 17, 2015 — SEMI announced today that the deadline for presenters to submit an abstract for the 27th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is November 2. ASMC, which takes placeMay 16-19, 2016 in Saratoga Springs, New York, will feature technical presentations of more than 90+ peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features keynotes, a panel discussion, networking events, technical sessions on advanced semiconductor manufacturing, as well as educational tutorials.
ASMC, in its 27th year, continues to fill a critical need in our industry and provides a venue for industry professionals to network, learn and share knowledge on new and best-method semiconductor manufacturing practices and concepts. Selected speakers have the opportunity to present in front of IC manufacturers, equipment manufacturers, materials suppliers, chief technology officers, operations managers, process engineers, product managers and academia. Technical abstracts are due November 2, 2015.
This year SEMI ( www.semi.org) is including two new technology areas (3D/TSV/Interposer; Fabless Experience). SEMI is soliciting technical abstracts in these key technology areas:
- 3D/TSV/Interposer
- Advanced Metrology
- Advanced Equipment Processes and Materials
- Advanced Patterning / Design for Manufacturability
- Advanced Process Control (APC)
- Contamination Free Manufacturing (CFM)
- Data Management and Data Mining Tools
- Defect Inspection and Reduction
- Discrete Power Devices
- Enabling Technologies and Innovative Devices
- Equipment Reliability and Productivity Enhancements
- Fabless Experience
- Factory Automation
- Green Factory
- Industrial Engineering
- Lean Manufacturing
- Yield Methodologies
Complete descriptions of each topic and author kit can be accessed at http://www.semi.org/en/node/38316. If you would like to learn more about the conference and the selection process, please contact Margaret Kindling at Email Contact or call1.202.393.5552.
Papers co-authored between device manufacturers, equipment or materials suppliers, and/or academic institutions that demonstrate innovative, practical solutions for advancing semiconductor manufacturing are highly encouraged. To submit an abstract, visit http://semi.omnicms.com/semi/asmc2016/collection.cgi
Technical abstracts are due November 2, 2015. Learn more about the SEMI Advanced Semiconductor Manufacturing Conference; visit http://www.semi.org/asmc2016.
About SEMI
SEMI is the global industry association serving the nano-and microelectronic manufacturing supply chains. Our 1,900 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit
www.semi.org.
Contact:
Deborah Geiger
Phone: 1.408.943.7988
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