First companion device to HyperFlash™ memory operating on the same HyperBus™ Interface simplifies board design and increases system performance

SUNNYVALE, Calif., Feb. 23, 2015 — (PRNewswire) —  Spansion Inc. (NYSE: CODE), a global leader in embedded systems solutions, today announced the first RAM device with the HyperBus™ interface. The Spansion HyperRAM™ memory, a companion to HyperFlash™ memory, enables a simple and cost-effective solution for SoCs and microcontrollers (MCU), where both the flash and RAM are connected on the same 12-pin HyperBus interface.  With a read throughput up to 333 megabytes-per-second, the HyperBus devices enable fast boot, graphics display and real-time XIP applications.

"Momentum continues to build for our HyperBus interface with many chipset suppliers adopting this high-performance solution. The addition of HyperRAM memory is a natural step in the evolution of the HyperBus interface and a perfect companion device to HyperFlash memory," said Jackson Huang, vice president of product marketing and ecosystem at Spansion.  "HyperRAM memory is ideal for SoCs with limited RAM and provides a scalable solution for extending fast read and write operations externally, allowing fast delivery of high-resolution graphics in the early part of the boot process for automotive, industrial and IoT applications. It also minimizes the number of pins that would normally be required to support standard DRAM, resulting in reduced PCB complexity and cost." 

Spansion HyperRAM memory can operate at frequencies as fast as 166MHz in DDR mode with a fast, random initial access time of 36ns.  Faster read access means less compressed, higher resolution graphics can be read, resulting in a sharper display.  The combination of HyperFlash and HyperRAM enables simpler board designs and software development, thus enabling faster time to market. Applications which can take advantage of these benefits include automotive instrument clusters, infotainment, navigation systems, advanced driver assistance systems (ADAS), digital cameras, projectors, factory automation, medical equipment, home automation and appliances, hand-held and other IOT devices.

Availability
Spansion 64Mb HyperRAM will be sampling in the second quarter of 2015.  It will be available in both 3V and 1.8V versions packaged in the market compatible 5x5 array BGA.

About Spansion HyperFlash™ Memory 
Spansion HyperFlash memory family will offer 3V and 1.8V power-supply versions and initially include three densities: 128Mb, 256Mb and 512Mb, with 512Mb samples available now. HyperFlash memories will be available in a space-saving 8x6mm ball grid array (BGA) package. Spansion HyperFlash memory devices provide a migration path—from one Quad SPI to two Quad SPI to HyperFlash memory—allowing system applications to be scaled to different levels of flash performance when paired with compatible controllers, giving OEMs the ability to offer different product models with a single design. 

About Spansion HyperBus™ Interface
The efficient 12-pin Spansion HyperBus interface consists of an 8-pin address/data bus, a differential clock (2 signals), one chip select and a read data strobe for the controller, reducing the overall cost of the system. Memories based on the interface enable faster systems with quicker response times and rich user experiences. The Spansion HyperBus interface enables a wide range of high-performance applications, such as automotive instrument clusters, infotainment / navigation systems, advanced driver assistance systems (ADAS), hand-held displays, digital cameras, projectors, factory automation, medical diagnostic equipment, and home automation and appliances.  Processors which have been publically announced to support the HyperBus interface include the Freescale MAC57D5xx Automotive DIS MCU, the Spansion FM4 S6E2DH general purpose MCU and the Spansion Traveo™ S6J324C and S6J326C automotive MCUs.  Spansion is working closely with many processor companies and more MCU/SoC support is expected.

Resources:

• Spansion HyperRAM Overview SlideShare presentation https://www.slideshare.net/Spansion/spansion-hyper-ram-presentation
• Spansion HyperFlash Memory Photos: http://news.spansion.com/image_gallery
• Spansion HyperBus and HyperFlash Overview SlideShare presentation: http://www.slideshare.net/Spansion/spansion-hyper-bus-interface
• Spansion HyperFlash Memory White Paper: http://learn.spansion.com/hyperbus-whitepaper
• Spansion newsroom: http://news.spansion.com 
• Spansion Core & Code technical magazine and blog: http://core.spansion.com
• Spansion on Twitter: http://www.twitter.com/spansion
• Spansion on Facebook: http://www.facebook.com/spansion  
• Spanion on LinkedIn  http://www.linkedin.com/company/spansion

About Spansion
Spansion (NYSE: CODE) is a global leader in embedded systems solutions. Spansion's flash memory, microcontrollers, analog and mixed-signal products drive the development of faster, intelligent, secure and energy efficient electronics. Spansion is at the heart of electronics systems, connecting, controlling, storing and powering everything from automotive electronics and industrial systems to the highly interactive and immersive consumer devices that are enriching people's daily lives. For more information, visit http:// www.spansion.com

Spansion^®, the Spansion logo, MirrorBit^®, HyperBus, HyperFlash, Traveo and combinations thereof, are trademarks or registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.

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SOURCE Spansion Inc.

Contact:

Spansion Inc. Spansion Press Contact, Michele Landry, 408-616-3817 Email Contact Spansion Investor Relations Contact, Rahul Mathur, 408-616-6682 Email Contact Web: http://www.spansion.com