TOKYO — (BUSINESS WIRE) — January 6, 2015 — Toshiba Corporation’s (TOKYO:6502) Semiconductor & Storage Products Company announced it will showcase a reference display of the world’s first[1] PCI Express (PCIe) single package SSD, integrating up to 256 GB in a single BGA package, at the 2015 International Consumer Electronics Show (CES), to be held from January 6 to January 9 in Las Vegas, U.S.A.
Toshiba: World's First PCI Express Single Package SSD (Photo: Business Wire)
The “BG Series” SSDs on reference display will be products under development. Utilizing Toshiba’s cutting-edge packaging technology applied in products like e・MMCTM, it is the world’s first PCI Express single package SSD, available in capacities up to 256 GB in a 16 mm x 20 mm x 1.65 mm BGA package. Also to be showcased will be a reference display of the world’s smallest[2] removable module type SSD, which integrates the BGA single package SSD on a single-sided form factor.
The new SSDs incorporate PCI Express, a high speed serial I/O interface for PCs, as physical interface and NVM Express optimized for SSDs as command interface.
The single package type SSDs of the new series weigh below 1 g, reducing weight by approximately 98%[3], compared to 2.5-inch types widely used in PCs. It also reduces storage space by more than 95%[4]. It can contribute to light-weight mobile PCs and also to longer battery life by increasing available space for battery packs.
Outline of the Reference Display
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BG Series |
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| Form Factor | Single Package type | |||||
| Capacity | 128 GB | 256 GB | ||||
| Size | W | 16 mm | 16 mm | |||
| D | 20 mm | 20 mm | ||||
| H | 1.40 mm | 1.65 mm | ||||
| Interface Standard | Physical | PCI Express Base Specification Revision 3.0 | ||||
| Command | NVM Express revision 1.1 | |||||
