LONDON — (BUSINESS WIRE) — December 12, 2014 — The Global Mixed Signal System on a Chip (SoC) IP market is expected to witness rapid technological advancements, and post a CAGR of 20.35 percent from 2014-2018, says research firm TechNavio.
There is currently high demand for high-performance devices with reliable and highly portable computing platforms. To respond to this, vendors in the market are exploring significant SoC design changes in areas such as power and performance requirements, in order to create systems with greater functionality, reduced size, and low power consumption.
About the Report
“As more functionalities converge onto a single chip, the design complexity of mixed signal SoCs has increased considerably,” says Faisal Ghaus, Vice President of Technavio.
“As a result, SoC designers are facing intense pressure to deliver innovative and differentiated products in less time and at lower prices. Chip manufacturers are now looking to third-party IPs to help mitigate the SoC complexities associated with 20nm planar FET, FinFET architectures, and 3D integration technology.”
The latest report from TechNavio also offers key insights in the emergence of 3D integration technology which presents a strong growth opportunity for the Global Mixed Signal SoC IP Market.
Key Information Covered in the Report:
- Market segmentation, size and forecast through 2018
-
Market Growth Drivers:
- Increased Demand for Wireless Computing Devices
- For a full detailed list, view our report.
-
Market Challenges:
- High Development Cost of Mixed Signal SoC IPs
- For a full detailed list, view our report.
-
Market Trends:
- Growing Technological Convergence
- For a full detailed list, view our report.
-
Key Vendors:
- ARM Holdings Inc.
- Cadence Design Systems Inc.
- Imagination Technologies Group plc
- Synopsys Inc.
-
Other Prominent Vendors:
- Ceva
- Faraday Technology
- Metso
- Silicon Image
TechNavio currently has more than 3000 market research reports on a huge range of topics, including 50+ reports on SoC IPs:
-- Global System-on-Chip (SoC) Market 2014-2018
If you are interested in more information, please contact our media team at media@technavio.com.
Contact:
TechNavio Research
Jes Ellacott,
US: +1 630-333-9501
UK:
+44 208 123 1770
Media & Marketing Executive
www.technavio.com
Email Contact
