eASIC Demonstrates 10Gbps JEDEC JESD204B

SANTA CLARA, Calif. — (BUSINESS WIRE) — December 8, 2014eASIC Corporation, (@easic) a fabless semiconductor company delivering a custom IC platform (eASIC Platform) announced today that it has successfully completed JESD204B interoperability at 10 Gbps lane rates. Analog Devices’ AD9234 12-bit, 1.0-GSPS high-speed dual analog-to-digital converter (ADC) can interoperate with the eASIC Nextreme-3 28nm, which greatly simplifies the design and integration of high bandwidth multi-channel radios.

“eASIC’s innovative platform enables OEMs to develop custom silicon solutions with optimal power, price, performance and time-to-market,” said Christian Lanzani, Director for Wireless at eASIC Corporation. “The combination of ADI’s AD9234 high-speed dual ADC and eASIC Nextreme-3 platform allows designers to optimize performance and power in developing next generation of energy-efficient backhaul, fronthaul and remote radio head systems.”

“Growing consumer demand for bandwidth requires radio solutions that deliver increased data throughput and lower power consumption. This trend is driving the adoption of the JESD204B interface standard in cellular back and front haul wireless network equipment,” said Paul Ganci, strategic marketing manager, point-to-point radio solutions, Analog Devices. “ADI offers a large portfolio of JESD204B supported products that enable customers to reduce their overall time to market.”

Click here for interoperability report: http://www.easic.com/products/request-documentation/

Click to Tweet- @easic #JESD204B interoperability report

About eASIC

eASIC is a fabless semiconductor company offering a custom IC platform (eASIC Platform) that incorporates a versatile base array, customizable single-mask layer and proprietary design tools. The breakthrough eASIC Platform provides the optimal combination of fast time-to-market, high performance, low power consumption, low development cost and low unit cost. The innovative eASIC Platform is enabled through a patented technology utilizing a single via mask layer for customizable and avoids the painful tradeoffs associated with ASICs, ASSPs and FPGAs.

Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Seagate Technology and Evergreen Partners. For more information on eASIC please visit www.easic.com/news or follow us on Twitter @easic.com.



Contact:

eASIC Corporation
Carey Mitchell, 408-855 9200
Email Contact

Featured Video
Jobs
Principal Engineer for Autodesk at San Francisco, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Upcoming Events
World Architecture Festival 2024 at Marina Bay Sands Singapore - Nov 6 - 8, 2024
Dimensions User Conference 2024 at The Venetian Resort Las Vegas NV - Nov 11 - 13, 2024
Greenbuild 2024 at Pennsylvania Convention Center Philadelphia PA - Nov 12 - 15, 2024
Digital Construction North (DCN) 2024 at Manchester Central. Manchester United Kingdom - Nov 13, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise