HiSilicon Expands Cadence Palladium XP Platform Usage For Mobile and Digital Media SoC and ASIC Development

SAN JOSE, Calif., May 12, 2014 — (PRNewswire) — Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that HiSilicon further expanded usage of the Cadence® Palladium® XP Verification Computing Platform as its emulation solution for mobile and digital media System-on-Chip (SoC) and ASIC development.

Cadence Logo

HiSilicon provides ASICs and SoCs for communication network and digital media, including solutions for network surveillance, videophones, Digital Video Broadcast and IPTV.  Solutions for these markets require a high level of quality, with robust hardware-software verification, and a quick turn-around time to meet aggressive time-to-market needs.

"We expanded our usage of the Palladium XP platform due to its performance, flexibility, hardware and software co-development efficiency and ability to shorten the time to market for our designs," said Yanqiu Diao, deputy GM, Turing Processor Business Unit at HiSilicon. "The power verification and analysis capabilities of Palladium XP are also a good match for our increasing number of low power mobile designs."

Part of the Cadence System Development Suite, the Palladium XP platform is the industry's first high-performance, special-purpose verification computing platform that unifies best-in-class simulation acceleration and emulation capabilities in a single environment. For more information on the Palladium XP platform, visit www.cadence.com/news/pxp.

About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.

© 2014 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, Palladium and the Cadence logo are registered trademarks of Cadence Design Systems, Inc. in the United States and other countries.  All other trademarks are the property of their respective owners.

For more information, please contact:
Cadence Newsroom
408-944-7039
Email Contact

Logo - http://photos.prnewswire.com/prnh/20140102/SF39436LOGO

SOURCE Cadence Design Systems, Inc.

Contact:
Cadence Design Systems, Inc.
HiSilicon
Web: http://www.cadence.com

Featured Video
Latest Blog Posts
Sanjay GangalAECCafe Today
by Sanjay Gangal
AEC Industry Predictions for 2025 — vGIS
Sanjay GangalIndustry Predictions
by Sanjay Gangal
AEC Industry Predictions for 2025 — QeCAD
Jobs
Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin
Upcoming Events
Consumer Electronics Show 2025 - CES 2025 at Las Vegas Convention Center Las Vegas NV - Jan 7 - 10, 2025
Commercial UAV Expo 2025 at Amsterdam Netherlands - Apr 8 - 10, 2025
Commercial UAV Expo 2025 at RAI Amsterdam Amsterdam Netherlands - Apr 8 - 11, 2025
Geospatial World Forum 2025 at Madrid Marriott Auditorium Madrid Spain - Apr 22 - 25, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise