Toshiba Introduces the Industry's First Bridge ICs That Convert 4K HDMI(R) to MIPI(R) CSI-2

Supports High Resolution Video Processing for Set Top Boxes and Smart TVs

TOKYO — (BUSINESS WIRE) — March 17, 2014Toshiba Corporation (TOKYO:6502) today announced the launch of “TC358840XBG”, the industry’s first1 interface bridge IC that converts 4K ultra HD video stream from HDMI® to MIPI® CSI-2 without compression and deterioration. Sample shipments will start in April, with mass production scheduled to start in September, 2014.

Toshiba: The industry's first interface bridge IC converting 4K ultra HD video stream from HDMI(R) t ...

Toshiba: The industry's first interface bridge IC converting 4K ultra HD video stream from HDMI(R) to MIPI(R) CSI-2 (Photo: Business Wire)

The new IC splits 4K ultra HD (3840 x 2160) video stream into the left and right images, and outputs from dual MIPI® CSI-2 interfaces. It supports conversion of high resolution 4K ultra HD video at 30 fps, contributing to high quality video processing.

The IC also supports conversion of HDMI® audio input stream to I2S, TDM, or MIPI SLIMbus® (Serial Low-power Inter-chip Media Bus), allowing use in a wide range of applications.

Key Features

  • HDMI® 1.4 RX support
    • 4K Ultra HD (3840x2160) @30fps (RGB, YCbCr444:24bpp, YCbCr422: 24bpp)
    • HDCP 1.3
    • 3D support
  • Availability of any of the three audio interfaces: I2S, TDM or SLIMbus® (Serial Low-power Inter-chip Media Bus)
  • Maximum 1Gbps/lane link speed MIPI® CSI-2 interface
  • Maximum 297MHz HDMI® clock speed

Applications

Set top boxes, smart TVs, smart monitors, and digital media adapters

 

Main Specifications

Part Number   TC358840XBG
Input Interface

HDMI® 1.4
Clock speed: 297MHz (Max.)

Output Video Interface Dual interfaces of MIPI® CSI-2 4 lanes (Up to 1Gbps/lane)
Output Audio Interface I2S, TDM, MIPI SLIMbus®
Source Voltage

MIPI®: 1.2V
CORE/PLL: 1.1V
HDMI®: 3.3V
I/O: 1.8V and 3.3V

Package  

FBGA80 (7mm×7mm, 0.65mm pitch)

 

1 | 2  Next Page »
Featured Video
Jobs
Principal Engineer for Autodesk at San Francisco, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Mechanical Engineer 2 for Lam Research at Fremont, California
GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington
Equipment Engineer, Raxium for Google at Fremont, California
Upcoming Events
World Architecture Festival 2024 at Marina Bay Sands Singapore - Nov 6 - 8, 2024
Dimensions User Conference 2024 at The Venetian Resort Las Vegas NV - Nov 11 - 13, 2024
Greenbuild 2024 at Pennsylvania Convention Center Philadelphia PA - Nov 12 - 15, 2024
Digital Construction North (DCN) 2024 at Manchester Central. Manchester United Kingdom - Nov 13, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise