Research and Markets ( http://www.researchandmarkets.com/research/jbnvs7/tdkepc_p8009) has announced the addition of the "TDK-EPC P8009 Module with Maxim Embedded Dies" report to their offering.
(Logo:
http://photos.prnewswire.com/prnh/20130307/600769 )
Key Features of this TDK-EPC P8009 Module with Maxim Embedded Dies report.
- One of the few high volume 3D embedded dies package
- Latest evolution of the TDK SESUB Process
The embedded die process of TDK-EPC, called SESUB (Semiconductor embedded in SUBstrate), is an innovative packaging technology based on the emerging embedded die in laminate substrate concept where all of the package assembly operations are done at the panel-scale level. A 4-layer 3D interconnection routing path with 20µm minimum line width is provided. This technology extends the package size beyond the ICs surface area and allows for mounting additional passives components on top of the laminated module.
With this packaging approach, TDK considerably changed the conventional supply chain model, where the chip maker sells directly to the system maker. Here the module maker is taking a larger role by adding considerable value.
This report provides a complete teardown of the embedded dies package with:
Detailed photos & Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth manufacturing cost analysis
- Supply chain evaluation
- Exhaustive cost breakdown and selling price estimation
Key Topics Covered:
- Glossary
- Overview/Introduction
- Companies Profile
- P8009 Characteristics & Supply Chain
- P8009 Physical Analysis
- Manufacturing Process Flow
- Cost Analysis
For more information visit http://www.researchandmarkets.com/research/jbnvs7/tdkepc_p8009
Research and Markets
Laura Wood, Senior Manager
Email Contact
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector:
Advanced Technology
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