eASIC and CST Reduce Multi-Level Package Design and Simulation Time by up to 5x

eASIC and Computer Simulation Technology (CST) to demonstrate up to 5x reduction in co-simulation time for multi-level PCB package design

SANTA CLARA, Calif. — (BUSINESS WIRE) — October 28, 2013 — eASIC® Corporation, a leading provider of Single Mask Adaptable ASIC™ devices and Computer Simulation Technology (CST) have teamed up to significantly reduce multi-level PCB package design and simulation. The solution will be presented at the Industry Spotlight session at EPEPS 2013 (Electrical Performance of Electronic Packaging and Systems) on October 28th.

The solution focuses on PCB package co-design and provides accurate, effective decomposition and segmentation modeling techniques for PCB package systems co-simulation. The techniques allow accurate accounting of all discontinuities present at the package interface while saving significant computational effort and resources. The methodologies reduce co-simulation time by up to 5X when compared to the full model simulation, while preserving higher accuracy when compared to traditional partitioning practices.

About eASIC

eASIC is a fabless semiconductor company offering breakthrough single mask ASIC devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology utilizing via-layer customizable routing. This innovative fabric allows eASIC to offer a new generation of ASICs with significantly lower up-front costs than traditional ASICs.

Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Seagate Technology (NASDAQ: STX) and Evergreen Partners. For more information on eASIC please visit www.easic.com.

eASIC and eASIC Nextreme are trademarks of eASIC Corporation and registered in the U.S. Patent and Trademark Office.

About CST

CST develops and markets high performance software for the simulation of electromagnetic fields in all frequency bands. Its success is based on the implementation of leading edge technology in a user- friendly interface. CST’s customers are market leaders in industries as diverse as Telecommunications, Defense, Automotive, Electronics, and Medical Equipment. Today CST employs 190 sales, development, and support personnel, and enjoys a leading position in the high frequency 3D EM simulation market. Further information about CST can be found at www.cst.com.



Contact:

eASIC Corporation
Niall Battson, 408-855-9200
Email Contact

Featured Video
Jobs
Senior Principal Software Engineer for Autodesk at San Francisco, California
Principal Engineer for Autodesk at San Francisco, California
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Mechanical Engineer 3 for Lam Research at Fremont, California
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington
Upcoming Events
Digital Twins 2024 at the Gaylord National Resort & Convention Center in, MD. National Harbor MD - Dec 9 - 11, 2024
Commercial UAV Expo 2025 at RAI Amsterdam Amsterdam Netherlands - Apr 8 - 11, 2025
Commercial UAV Expo 2025 at Amsterdam Netherlands - Apr 8 - 10, 2025
BI2025 - 13th Annual Building Innovation Conference at Ritz-Carlton Tysons Corner McLean VA - May 19 - 21, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise