Cadence Design Tools Certified for TSMC 16nm FinFET Process and for TSMC 20nm Process

SAN JOSE, CA -- (Marketwired) -- May 29, 2013 -- Cadence Design Systems, Inc. (NASDAQ: CDNS)

HIGHLIGHTS

  • DRM and SPICE model V0.1 tool certification provides chip designers early access to TSMC 16-nanometer FinFET process
  • Full flow certification achieved for TSMC 20-nanometer process

Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that several of its system-on-chip development tools have achieved version 0.1 of design rule manual (DRM) and SPICE model tool certification for TSMC's 16-nanometer FinFET process. The completion of the early stage tool certification milestone means advanced node customers can start developing designs and leveraging the lower power and higher performance benefits required for next-generation mobile platforms.

The tool certification serves as the foundation of design infrastructure for 16-nanometer FinFET technology. The certified Cadence® tools are Spectre, Liberate, Virtuoso®, Encounter® Digital Implementation (EDI) System, Encounter Timing System, Virtuoso Power System, Encounter Power System, Physical Verification System and QRC Extraction. Several Cadence design IP offerings are also available for customer test chips at this advanced node.

Additionally, TSMC has certified the production-ready Cadence design flow for its 20-nanometer manufacturing process. Customers can now take full advantage of the Cadence solution to reap the speed, power and area benefits of this advanced node.

The full tool chain was certified at 20 nanometers through the design of an ARM® Cortex®-A9 processor, and is the first integrated tool certification for TSMC 20SoC process technology. The Cadence tools used are Virtuoso, EDI System, Encounter Timing System, Encounter Power System, Virtuoso Power System, Physical Verification System and QRC Extraction.

"Vertical collaboration at the earliest possible stages of solution development is key to delivering co-optimized solutions," said Dr. Chi-Ping Hsu, senior vice president of research and development, Silicon Realization Group at Cadence. "TSMC's certification of Cadence tools for 16-nanometer FinFET and 20-nanometer design underscores our joint commitment to working with our customers to help ensure their success."

"Our early DRM & SPICE certification, achieved through TSMC's Open Innovation Platform® collaboration model, informs design teams that they can confidently use these Cadence tools for early development of high-performance, low-power 16-nanometer FinFET designs," said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. "And the certification of the Cadence tools for 20SoC indicates their readiness for this advanced technology process."

Today's announcement complements the first ARM Cortex-A57 64-bit processor implemented in FinFET technology, also developed using Cadence technology. Cadence and TSMC also recently announced their collaboration on 16 nanometers.

About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

Cadence and the Cadence logo are registered trademarks of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.

Add to Digg Bookmark with del.icio.us Add to Newsvine

For more information, please contact:
Dean Solov
Cadence Design Systems, Inc.
408-944-7226

Email Contact 


Featured Video
Jobs
Senior Principal Software Engineer for Autodesk at San Francisco, California
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Principal Engineer for Autodesk at San Francisco, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Mechanical Engineer 3 for Lam Research at Fremont, California
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Upcoming Events
Digital Twins 2024 at the Gaylord National Resort & Convention Center in, MD. National Harbor MD - Dec 9 - 11, 2024
Commercial UAV Expo 2025 at RAI Amsterdam Amsterdam Netherlands - Apr 8 - 11, 2025
Commercial UAV Expo 2025 at Amsterdam Netherlands - Apr 8 - 10, 2025
BI2025 - 13th Annual Building Innovation Conference at Ritz-Carlton Tysons Corner McLean VA - May 19 - 21, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise