SEMI 3D & Systems Summit to Spotlight Trends in High-Performance, Energy-Efficient Applications
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SEMI 3D & Systems Summit to Spotlight Trends in High-Performance, Energy-Efficient Applications

DRESDEN, Germany — May 16, 2022 — Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 14-15 June, 2022, in Dresden for insights into the latest heterogenous integration innovations enabling the future of intelligent systems for semiconductor manufacturing and applications. Registration is open.

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“We look forward to bringing together industry leaders for their perspectives on near-term 3D roadmaps and how the semiconductor industry can enable innovation for emerging applications,” said Laith Altimime, president of SEMI Europe. “Their insights promise to help the semiconductor industry address  new technology challenges and requirements across the entire supply chain.”

Themed Enabling Low-Energy and High-Performance Applications, SEMI 3D & Systems Summit returns to Dresden with a broader scope of topics including: 

3D & Systems Summit Keynotes

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Yvonne Keil, Director Global Indirect Procurement, GlobalFoundries
GlobalFoundries - timely
                                    rebranding and new perspectives
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                                    preview
E. Jan Vardaman, President,
TechSearch International, Inc.
TechSearch International
                                    Explores Power Device Packaging and
                                    Assembly Trends - 3D InCites


Global Leaders to Present

3D & Systems Summit presenters include experts from global leaders such as AT&S, Atotech, Besi, CEA-Leti, DeepXscan, ETH Zurich, EV Group (EVG), Evatec AG, Fraunhofer IZM, GlobalFoundries, imec, Intel Deutschland GmbH, KLA, Merck Group, NanoWired GmbH, Siemens EDA, SENTECH, Sipearl, SPTS Technologies, SÜSS MicroTec, TechSearch, and Yole Développement.Exhibition and Networking

The most prominent names in 3D integration microelectronics manufacturing will showcase their latest products and technologies at the exhibition area, including: AEMtec, BESI, Confovis, Evatec, EV Group, FormFactor FRT Metrology, Fraunhofer IZM-ASSID, HEIDENHAIN, Koh Young Europe GmbH, LPKF Laser & Electronics AG, OPTIM Wafer Services, Polyteknik AS and RENA.

The summit will also feature business-to-business matchmaking and networking for participants to explore new partnerships and other business opportunities.

To reserve an exhibition space, contact Adi Hodorov at ahodorov@semi.org and euevents@semi.org.

For more details, please visit the 3D & Systems Summit website and connect with SEMI Europe on  Twitter or  LinkedIn – @SEMIEurope, #3DSummit.

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About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on  LinkedIn and  Twitter.

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email:  sbrischetto@semi.org